Technical Capabilities:

Technical Capabilities:

No. of layer:

8 layers

Max Board Size:

400 x 500mm

Max. Board thickness

3.20mm

Min. Board thickness

0.20 mm

Min. finished via hole size:

0.20mm

Minimum annular ring

0.20mm

Drill to Drill Clearance

0.20mm

Minimum Clearance b/w Traces

0.20mm

Minimum Trace Width

0.15mm

 

Surface Finish:

HASL (Lead Free & PB/Sn)

Electrolytic Gold

Immersion silver

Immersion tin

Tolerances:

Pcb Size: +/- 0.20 mm

PCB Thickness: +/- 10%

Copper thickness inside hole: +/- 0.20mm